| 摘要 |
PROBLEM TO BE SOLVED: To provide an auxiliary film for dicing never diced together with an adherent such as a semiconductor wafer or the like in a dicing process using a laser. SOLUTION: The auxiliary film 2 for dicing is constituted to have an inorganic pigment charged layer 11 containing an inorganic pigment and a binder resin, preferably constituted such that the inorganic pigment charged layer 11 constitutes a biaxial oriented plastic film charged with the inorganic pigment, preferably constituted to have an adhesion layer 12 on the inorganic pigment charged layer 11, and preferably constituted to use a silica and/or a calcium carbide as the inorganic pigment. COPYRIGHT: (C)2011,JPO&INPIT |
