发明名称 |
Magnetically coupled galvanically isolated communication using lead frame |
摘要 |
An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within encapsulation. The lead frame includes a first conductor having a first conductive loop disposed substantially within the encapsulation. The lead frame also includes a second conductor that is galvanically isolated from the first conductor. The second conductor includes a second conductive loop that is substantially disposed within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors. |
申请公布号 |
EP2733739(A2) |
申请公布日期 |
2014.05.21 |
申请号 |
EP20130192743 |
申请日期 |
2013.11.13 |
申请人 |
POWER INTEGRATIONS, INC. |
发明人 |
BALAKRISHNAN, BALU;MATTHEWS, DAVID MICHAEL HUGH |
分类号 |
H01L23/495;H02M3/335 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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