发明名称 THIN FILM DEVICE AND MANUFACTURING METHOD THEREOF
摘要 In a thin film device including a thin film electrode which has a main electrode layer formed of tungsten, a thin film electrode having a low resistivity is realized. There is provided a thin film device (1) including a thin film electrode (7) which has an underlayer (7A) and a main electrode layer (7B) formed on the underlayer (7A), the underlayer (7A) is formed of a titanium-tungsten alloy having a crystalline structure with a wavy-like surface morphology, and the main electrode layer (7B) is formed of tungsten having a crystalline structure with a wavy-like surface morphology.
申请公布号 EP2733114(A1) 申请公布日期 2014.05.21
申请号 EP20120815405 申请日期 2012.07.10
申请人 MURATA MANUFACTURING CO., LTD. 发明人 UMEDA, KEIICHI
分类号 B81C1/00;C23C14/02;C23C14/16;H01G4/33;H01G5/16;H03H3/02;H03H3/04;H03H9/02;H03H9/13;H03H9/17;H03H9/24 主分类号 B81C1/00
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