发明名称 Stamp structures and transfer methods using the same
摘要 A stamp structure includes a stamp frame having a plate part. The plate part includes a plurality of holes. The plurality of holes are configured to facilitate the adsorption of an object to the plate part during a transfer of the object from a donor substrate to a target substrate.
申请公布号 EP2733733(A2) 申请公布日期 2014.05.21
申请号 EP20130192822 申请日期 2013.11.14
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 YANG, KI-YEON;NAM, YUN-WOO
分类号 H01L21/683;B41N6/00 主分类号 H01L21/683
代理机构 代理人
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