ROLLED COPPER FOIL WITH COPPER PLATING LAYER

摘要

The present invention relates to a rolled copper foil with a copper plating layer to provide excellent folding endurance after recrystalization and annealing. The rolled copper foil is made of oxygen-free copper or rare copper alloy having the oxygen-free copper as parent phase, and the copper plating layer is formed on the primary surface or at least one surface of the underside of the rolled copper foil, so that in the state where the rolled copper foil is recrystalized through quenching and tempering, at least a portion of the crystal grains of the copper plating layer is integrated with the quenched and tempered crystal grains of the rolled copper foil.