发明名称
摘要 A semiconductor structure includes: a germanium layer 30; and an aluminum oxynitride film 32 that is formed on the germanium layer, wherein: an EOT of the aluminum oxynitride film is 2 nm or less; Cit/Cacc is 0.4 or less; on a presumption that Au acting as a metal film is formed on the aluminum oxynitride film, the Cit is a capacitance value between the germanium layer and the metal film at a frequency of 1 MHz in a case where a voltage of the metal film with respect to the germanium layer is applied to an inversion region side by 0.5 V; and the Cacc is a capacitance value between the germanium layer and the metal film in an accumulation region.
申请公布号 JP5499225(B1) 申请公布日期 2014.05.21
申请号 JP20130543456 申请日期 2013.03.11
申请人 发明人
分类号 H01L29/78;H01L21/318;H01L21/336 主分类号 H01L29/78
代理机构 代理人
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