| 摘要 |
<p>The method involves providing a mold with an upper filling portion and a lower filling portion, which is arranged adjacent to the upper filling portion in a vertical direction and formed by a recess. The lower filling section is filled with a filling compound (4.2) comprising a lightweight filler i.e. expanded glass granulates, and a bonding agent i.e. epoxy resin. The upper filling portion is filled with another filling compound (4.1) comprising a lightweight filler and binder, where the latter compound is combined with the former compound such that the bonding agents are cured. Independent claims are also included for the following: (1) a mold for manufacturing an air-conditioned floor plate (2) an air-conditioned floor plate.</p> |
