| 摘要 |
The present invention relates to a lighting module and a manufacturing method thereof. According to the present invention, the lighting module is configured to include: a frameless LED package which comprises an LED chip including a light emitting surface to the upper surface of the chip, a plurality of connection electrodes formed on the same plane of the lower surface of the chip on the LED chip, and a molding lens molding a part of the LED chip so as expose the lower surface of the chip and to include the front portion of at least the upper surface of the chip and a part of the side surface of the chip on the LED chip, and transmitting the light output through a light exit surface; and a substrate having the frameless LED package mounted thereon and electrically connecting to the LED chip through the connection electrodes, wherein the upper surface of the substrate is spaced apart from the lower surface of the molding lens and the lower surface of the chip. |
