Method and device for inspecting wafers

摘要

The method involves providing the wafers (6,7) to-be-inspected. The wafer (6) is passed through the through-flow path (9) to a reversal position. The second wafer (7) is passed over the through-flow path to a return position, while passing the inspected wafer (6) to a decrease station (40). The inspected wafer (6) is fed behind the wafer (7) to the end of the through-flow path. The wafer (6) is fed over the through-flow path to reversal position while passing the inspected wafer (7) to a decrease station (41). An independent claim is included for device for inspecting wafer.