半导体装置及其制造方法,申请号TW100116105-传众专利搜索

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发明名称	半导体装置及其制造方法
摘要
申请公布号	TWI438875	申请公布日期	2014.05.21
申请号	TW100116105	申请日期	2011.05.09
申请人	台湾积体电路制造股份有限公司新竹市新竹科学工业园区力行六路8号	发明人	林彦甫;林俊成;邱文智;郑心圃;余振华
分类号	H01L23/28;H01L23/544	主分类号	H01L23/28
代理机构		代理人	洪澄文台北市南港区三重路19之6号2楼;颜锦顺台北市南港区三重路19之6号2楼
主权项
地址	新竹市新竹科学工业园区力行六路8号

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