| 摘要 |
The invention provides a brittle material substrate processing method. The brittle material substrate having quite a large on-line expansion coefficient is provided with a mesh-like scribing groove. Bad segmentation can be reduced during cutting. The processing method is to irradiate pulse laser to the brittle material substrate along a mesh-like cutting predetermined line to cut the brittle material substrate. The processing method comprises a first process, a second process and a third process. In the first process, the pulse laser is scanned along a cutting predetermined line extending in a first direction and a first scribing groove is disposed at the front face of the substrate. In the second process, the pulse laser will not be overlapped and can be irradiated along a cutting predetermined line extending in a second direction vertical to the first direction, and a second scribing groove is disposed at the front face of the substrate. In the third process, two sides of the scribing groove are pressed, and the substrate is cut along each scribing groove. |
