| 摘要 |
A method of manufacturing a printed circuit board or a sub-assembly thereof comprises the following steps:
- providing at least two elements (1, 3) of insulating material
- coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface
- covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface
- building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material. Furthermore a printed circuit board (10) or sub-assembly thereof is provided. |
