发明名称 |
Semiconductor package and a method for selecting a chip in the semiconductor package |
摘要 |
A semiconductor package includes a first semiconductor chip formed with a first through-silicon via; a second semiconductor chip stacked over the first semiconductor chip and formed with a second through-silicon via; and a cantilever formed over the first semiconductor chip and electrically connected to the first through-silicon via or the second through-silicon via according to an electrical signal. |
申请公布号 |
US8729686(B2) |
申请公布日期 |
2014.05.20 |
申请号 |
US201113311841 |
申请日期 |
2011.12.06 |
申请人 |
KANG TAE MIN;SK HYNIX INC. |
发明人 |
KANG TAE MIN |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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