发明名称 Wafer level camera module and method of manufacture
摘要 A method includes forming optical lenses on an ICD at the wafer level, rather than attaching a separate lens assembly. The lenses may be formed as an array of individual lenses or as multiple, e.g., two, arrays of individual lenses. The array of lenses may be coupled to an array of ICDs. The ICDs and individual lenses in the array assembly may be singulated to form individual digital camera modules. Additionally or alternatively, the ICDs and individual lenses may be singulated in separate steps.
申请公布号 US8730369(B2) 申请公布日期 2014.05.20
申请号 US201313909808 申请日期 2013.06.04
申请人 DIGITALOPTICS CORPORATION 发明人 SINGH HARPUNEET
分类号 G02B13/16;H01L31/0203;H04N5/225 主分类号 G02B13/16
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