发明名称 |
COPPER FOIL FOR FLEXIBLE PRINTED WIRING BOARD |
摘要 |
Provided is a copper foil for a flexible printed wiring board having high thickness precision. The surface roughness (Ra) in the direction parallel to rolling has a mean value (Raavg) of 0.01 to 0.15 µm, and DeltaRa=Ramax-Ramin is 0.025 µm or less. |
申请公布号 |
KR20140060580(A) |
申请公布日期 |
2014.05.20 |
申请号 |
KR20147009943 |
申请日期 |
2012.09.18 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
NISHIDA SHUTARO;SAMEJIMA DAISUKE;NAKAMURO KAICHIRO |
分类号 |
H05K1/09;C22C9/00;C25D7/06 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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