发明名称 COPPER FOIL FOR FLEXIBLE PRINTED WIRING BOARD
摘要 Provided is a copper foil for a flexible printed wiring board having high thickness precision. The surface roughness (Ra) in the direction parallel to rolling has a mean value (Raavg) of 0.01 to 0.15 µm, and DeltaRa=Ramax-Ramin is 0.025 µm or less.
申请公布号 KR20140060580(A) 申请公布日期 2014.05.20
申请号 KR20147009943 申请日期 2012.09.18
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 NISHIDA SHUTARO;SAMEJIMA DAISUKE;NAKAMURO KAICHIRO
分类号 H05K1/09;C22C9/00;C25D7/06 主分类号 H05K1/09
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