发明名称 |
Microelectronic packages and methods therefor |
摘要 |
A method of making a microelectronic assembly can include molding a dielectric material around at least two conductive elements which project above a height of a substrate having a microelectronic element mounted thereon, so that remote surfaces of the conductive elements remain accessible and exposed within openings extending from an exterior surface of the molded dielectric material. The remote surfaces can be disposed at heights from said surface of said substrate which are lower or higher than a height of the exterior surface of the molded dielectric material from the substrate surface. The conductive elements can be arranged to simultaneously carry first and second different electric potentials: e.g., power, ground or signal potentials. |
申请公布号 |
US8728865(B2) |
申请公布日期 |
2014.05.20 |
申请号 |
US201113012949 |
申请日期 |
2011.01.25 |
申请人 |
HABA BELGACEM;KANG TECK-GYU;MOHAMMED ILYAS;CHAU ELLIS;TESSERA, INC. |
发明人 |
HABA BELGACEM;KANG TECK-GYU;MOHAMMED ILYAS;CHAU ELLIS |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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