发明名称 |
Method and apparatus for selectively removing anti-stiction coating |
摘要 |
The present disclosure provides various methods for removing an anti-stiction layer. An exemplary method includes forming an anti-stiction layer over a substrate, including over a first substrate region of a first material and a second substrate region of a second material, wherein the second material is different than the first material; and selectively removing the anti-stiction layer from the second substrate region of the second material without using a mask. |
申请公布号 |
US8728845(B2) |
申请公布日期 |
2014.05.20 |
申请号 |
US201113071334 |
申请日期 |
2011.03.24 |
申请人 |
LIN SHIH-WEI;LIU PING-YIN;CHAO LAN-LIN;PENG JUNG-HUEI;TSAI CHIA-SHIUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LIN SHIH-WEI;LIU PING-YIN;CHAO LAN-LIN;PENG JUNG-HUEI;TSAI CHIA-SHIUNG |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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