发明名称 Method and apparatus for selectively removing anti-stiction coating
摘要 The present disclosure provides various methods for removing an anti-stiction layer. An exemplary method includes forming an anti-stiction layer over a substrate, including over a first substrate region of a first material and a second substrate region of a second material, wherein the second material is different than the first material; and selectively removing the anti-stiction layer from the second substrate region of the second material without using a mask.
申请公布号 US8728845(B2) 申请公布日期 2014.05.20
申请号 US201113071334 申请日期 2011.03.24
申请人 LIN SHIH-WEI;LIU PING-YIN;CHAO LAN-LIN;PENG JUNG-HUEI;TSAI CHIA-SHIUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN SHIH-WEI;LIU PING-YIN;CHAO LAN-LIN;PENG JUNG-HUEI;TSAI CHIA-SHIUNG
分类号 H01L21/56 主分类号 H01L21/56
代理机构 代理人
主权项
地址