| 摘要 |
FIELD: process engineering.SUBSTANCE: invention relates to laser cutting of parts (3) at variable cutting speed (v) along cutting line (L1, L2). Proposed system comprises moving head (10) for laser beam positioning the laser beam (5) on part (3), user's interface (45) to set cutting line (L1, L2) and to set required laser beam (5) path precision (?B) and device (20) to control displacement of laser beam head (10) along said lines (L1, L2) in compliance with set of processing parameters (LL, DF, D0, ?B, DS, DD, PG). First subset (G1) is composed of parameters (LL, DF, D0, ?B, DS, DD, PG) and comprises solely one parameter (LL) or more of them (LL) that influences laser beam power available for cutting. Second subset (G2) is composed of parameters (DF, D0, ?B, DS, DD, PG) and comprises parameters that do not influence laser beam power available for cutting. At least one parameter of said second subset can be controlled by device (20) subjected to at least one variable control parameter (S20, S21, S22, S23, S24, S25, S26, S27) subject to processing head recorded speeds (vg1, vg2).EFFECT: uniform cut surfaces at high cutting speed.15 cl, 10 dwg, 1 tbl |
