APPARATUS FOR SOLDERING OR UNSOLDERING MICROCIRCUITS ON PRINTED-CIRCUIT BOARD

摘要

FIELD: physics.SUBSTANCE: invention can be used in soldering and repair centres or infrared soldering stations for soldering microcircuits in a BGA housing and other surface mounted microcircuits. A housing having an infrared heater mounted inside is mounted such that it can be positioned over a work bench with a printed-circuit board at a controlled distance. The lower part of the housing is fitted with a diaphragm with an opening which bounds the heating area of the soldered microcircuit. The diaphragm has an infrared radiation concentrator situated on the periphery of the opening of the diaphragm and is in form of a reflecting element, placed vertically and/or inclined in the direction from the infrared heater. The ratio of the dimensions of the opening of the diaphragm, height and/or angle of inclination of the reflecting element is selected based on a condition for obtaining given dimensions of the heating area and specific power of infrared radiation in the area of the soldered microcircuit.EFFECT: high uniformity and specific power of the temperature field generated by infrared rays on the surface of the board and microcircuit owing to reflection of the infrared rays.7 cl, 5 dwg