| 发明名称 |
Connector structures of integrated circuits |
| 摘要 |
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad. |
| 申请公布号 |
US8729699(B2) |
申请公布日期 |
2014.05.20 |
| 申请号 |
US201113276090 |
申请日期 |
2011.10.18 |
| 申请人 |
TU SHANG-YUN;CHUANG YAO-CHUN;TSENG MING HUNG;KUO CHEN-CHENG;CHEN CHEN-SHIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
TU SHANG-YUN;CHUANG YAO-CHUN;TSENG MING HUNG;KUO CHEN-CHENG;CHEN CHEN-SHIEN |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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