发明名称 Minimizing thermal effect during material removal using a laser
摘要 A process to cut sheet material using a laser is improved by performing a first plurality of routings using a first toolpath for the laser and performing at least a second routing using a second toolpath for the laser after performing the first plurality of routings using the first toolpath, the second toolpath traverse from a kerf formed by the laser as a result of performing the first plurality of routings. A z-height shift can be simultaneously implemented with the transverse shift. By shifting the toolpath, interference of plasma generated during laser processing is minimized by maximizing the coupling of the laser and the material, resulting in less discoloration and/or burning of the material.
申请公布号 US8729427(B2) 申请公布日期 2014.05.20
申请号 US20090413084 申请日期 2009.03.27
申请人 OSAKO YASU;ELECTRO SCIENTIFIC INDUSTRIES, INC. 发明人 OSAKO YASU
分类号 B23K26/00 主分类号 B23K26/00
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