发明名称 Technique for remanufacturing a medical sensor
摘要 Present embodiments include a remanufactured bandage-type medical sensor having an optical assembly with an emitter adapted to transmit one or more wavelengths of light and a photodetector adapted to receive the one or more wavelengths of light transmitted by the emitter. The sensor also includes a laminate assembly having an electrically conductive adhesive transfer tape (ECATT) layer disposed over the photodetector, and the ECATT layer is adapted to shield the photodetector from electromagnetic interference (EMI). A nonconductive layer supports the emitter, the photodetector, and the ECATT layer within the sensor. At least a portion of the optical assembly is from a used bandage-type medical sensor, and at least a portion of the laminate assembly is new.
申请公布号 US8726496(B2) 申请公布日期 2014.05.20
申请号 US201113239681 申请日期 2011.09.22
申请人 BESKO DAVID P.;COVIDIEN LP 发明人 BESKO DAVID P.
分类号 H05K3/20 主分类号 H05K3/20
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