发明名称 High-molecular-weight copolymer
摘要 It is an object of the present invention to provide (1) a copolymer for a cured product that is satisfactory in properties, such as adhesion properties, as a chip stacking adhesive or the like. The present invention is a copolymer comprising repeating units represented by formula (I), formula (II), and formula (III), (wherein R1, R2, and R3 each independently represent a hydrogen atom or a methyl group, R4 represents an alkyl group or a cycloalkyl group, R5 represents a hydrogen atom or a C1 to C6 alkyl group, m, n, and k represent a molar ratio of the respective repeating units, m represents a positive number of 0 or more and less than 1, n and k each independently represent a positive number, and satisfy a relation of m+n+k=1), and having a weight-average molecular weight in the range of 50,000 to 200,000.
申请公布号 US8729187(B2) 申请公布日期 2014.05.20
申请号 US201013384929 申请日期 2010.08.04
申请人 TAKAHASHI EIJI;MARUMO SHINJI;MISHIMA GOU;NIPPON SODA CO., LTD. 发明人 TAKAHASHI EIJI;MARUMO SHINJI;MISHIMA GOU
分类号 C08F257/02 主分类号 C08F257/02
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