| 摘要 |
A system and method for reducing warpage of a semiconductor wafer. The system includes a device for securing the semiconductor wafer in a heating area. The device includes a holding mechanism for securing an edge of the semiconductor wafer. The device further includes a pressure reducing device that reduces the pressure underneath the semiconductor device, which further secures the semiconductor device in the heating area. The heating area includes a plurality of heating and cooling zones in which the semiconductor wafer is subjected to various temperatures. |
