ABRASIVE ARTICLE (VERSIONS) AND METHOD OF SAPPHIRE CUTTING THEREWITH

摘要

FIELD: process engineering.SUBSTANCE: invention relates to abrasive processing and can be used for wafer slicing of mono- and polycrystalline materials. Abrasive article comprises elongated body, binder ply on its surface and abrasive grains contained on said binder ply with mean concentration of abrasive grains of approx. 0.02 car/m and 0.30 car/m. Invention covers the method of sapphire cutting with the help of aforesaid abrasive article.EFFECT: higher wear resistance and longer life.15 cl, 8 dwg