| 发明名称 |
INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING THERMAL CONDUCTIVITY AND IMPROVED ELECTRICAL PROPERTIES, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD |
| 摘要 |
<p>Provided in the present invention are an insulation resin composition for a printed circuit board comprising an epoxy resin, a first inorganic filler having 20 W/mK or more of thermal conductivity, and a second inorganic filler having less than 10 of relative permittivity; an insulating film; a prepreg; and a printed circuit board.</p> |
| 申请公布号 |
KR101397221(B1) |
申请公布日期 |
2014.05.20 |
| 申请号 |
KR20130061748 |
申请日期 |
2013.05.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JUNG, HYUN CHUL;KANG, JOON SEOK;SON, JANG BAE;SHIN, SANG HYUN;LEE, KWANG JIK;SHIN, HYE SOOK |
| 分类号 |
H01B3/40;H01B3/12;H01B17/62;H05K1/05 |
主分类号 |
H01B3/40 |
| 代理机构 |
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