COMPRESSION MOLDING INSPECTION METHOD

摘要

The present invention relates to a compression molding inspection method that prevents wastes of an actual circuit board mounted with a circuit part or a chip and that can inspect molding quality of a compression molding device. More specifically, the present invention relates to a compression molding inspection method of the compression molding device, comprising an initial mold fixing the circuit board to be molded, and a second mold which has a filling space where a molding material for molding the circuit board to be molded is filled therein.