发明名称 Method for manufacturing silicon carbide semiconductor device with a single crystal substrate
摘要 On a single-crystal substrate, a drift layer is formed. The drift layer has a first surface facing the single-crystal substrate, and a second surface opposite to the first surface, is made of silicon carbide, and has first conductivity type. On the second surface of the drift layer, a collector layer made of silicon carbide and having second conductivity type is formed. By removing the single-crystal substrate, the first surface of the drift layer is exposed. A body region and an emitter region are formed. The body region is disposed in the first surface of the drift layer, and has the second conductivity type different from the first conductivity type. The emitter region is disposed on the body region, is separated from the drift layer by the body region, and has first conductivity type.
申请公布号 US8728877(B2) 申请公布日期 2014.05.20
申请号 US201213687883 申请日期 2012.11.28
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 WADA KEIJI;MASUDA TAKEYOSHI
分类号 H01L21/332;H01L21/30;H01L21/46;H01L29/15 主分类号 H01L21/332
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