| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having high reliability and a method of manufacturing the same.SOLUTION: The wiring board includes: an interlayer insulating layer 26a; a conductor layer 31a formed on the interlayer insulating layer 26a; an interlayer insulating layer 33a provided on the interlayer insulating layer 26a and the conductor layer 31a; a wiring structure 10 which is disposed on the interlayer insulating layer 26a and has an insulating layer 120 and a conductor layer 111 on the insulating layer 120; a conductor layer 36a formed on the interlayer insulating layer 33a; and a via conductor 35a which is formed inside the interlayer insulating layer 33a and connects the conductor layer 31a and the conductor layer 36a. In the wiring structure 10, first and second conductor layers 131 and 31 as a positioning pattern for positioning the wiring structure 10 at a predetermined position on the interlayer insulating layer 26a are formed. |
