发明名称 FLOW RATE MEASURING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a flow rate measuring device in which no cracks arise in a housing even in such a severe environment as hot-cold cycles irrespective of an inexpensive configuration, and high quality can be ensured.SOLUTION: In a housing 3 included in a flow rate measuring device, there is provided, between a pair of adhesive filling holes 52 for fixing lead wires 5b of a temperature sensor 5, a thermal stress absorption groove 54 having a larger volume than the holes 52 each. Consequently, even if there is a difference in thermal expansion between a molded resin of the housing 3 and an adhesive, expansion and contraction of the thermal stress absorption groove 54 provided between the adhesive filling holes 52 enable thermal stress to be absorbed, and no cracks arise in the housing 3 even in such a severe environment as hot-cold cycles. Also, such a simple structure as being only provided with the thermal stress absorption groove 54, further because of being capable of integrally forming the groove 54 during resin molding of the housing 3, requires specially no man-hour for disposing the thermal stress absorption groove 54.
申请公布号 JP2014092430(A) 申请公布日期 2014.05.19
申请号 JP20120242626 申请日期 2012.11.02
申请人 DENSO CORP 发明人 TAGAWA HIROSHI ; SUDO AKIYUKI
分类号 G01F1/684 主分类号 G01F1/684
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