| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve heat transfer performance between a semiconductor element and an electrode.SOLUTION: A semiconductor device comprises a circuit board on which a semiconductor element 21 is bonded. In the circuit board, a first metal plate 13, a second metal plate and a third metal plate are arranged on a top face of the insulating substrate. An undersurface 22a of an emitter electrode 22 of the semiconductor element 21 and a top face 13a of the first metal plate 13 are bonded with a conductive adhesive. A plurality of salients 41 are formed on the undersurface 22a of the emitter electrode 22 and the top face 13a of the first metal plate 13. The salients 41 are particles having good thermal conductivity which adhere to the undersurface 22a of the emitter electrode 22 and the top face 13a of the first metal plate 13. A conductive filler 51 is brought in contact with outer peripheral edges of a plurality of salients 41 (adjacent salients 41) without entering between the adjacent salients 41.</p> |
