发明名称 Method of forming a trench and method of manufacturing a semiconductor device using the same
摘要 In methods of forming a trench, first patterns separated from each other by a first width and second patterns separated from each other by a second width are formed on a substrate. The second width is wider than the first width. The substrate is etched using the first patterns and the second patterns to form a first trench having a first depth and a preliminary second trench having a second depth. A sacrificial layer is formed to fill up a space between the first patterns. The substrate is etched using the sacrificial layer to form a second trench having a third depth deeper than the second depth.
申请公布号 KR101396124(B1) 申请公布日期 2014.05.19
申请号 KR20070134840 申请日期 2007.12.21
申请人 发明人
分类号 H01L21/76 主分类号 H01L21/76
代理机构 代理人
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