| 摘要 |
An integrated circuit package comprises a first memory die (458-1) having a first set of connections, a second memory die (458-2) arranged adjacent to the first memory die, the second memory die having a second set of connections, a first substrate (470) having a first opening (472-1) and a second opening (472-2), the first substrate having a third set of connections to connect (474-1) to the first set of connections of the first memory die via the first opening and a fourth set of connections to connect (474-2) to the second set of connections of the second memory die via the second opening, and a second substrate (456) having a first integrated circuit (454) disposed thereon. The first substrate is connected (460-2) to the second substrate with the first integrated circuit disposed between the first substrate and second substrate. |
