| 摘要 |
PROBLEM TO BE SOLVED: To provide an air-cooled heat dissipation device having high heat dissipation effect, which can remove heat generated from a high-end electronic component effectively.SOLUTION: A heat dissipation device has a plurality of heat dissipation fins, a heat pipe, and a fan, and comes into thermal contact with a heat source. Each heat dissipation fin has a plate 110, and an air guide 120. The plate has a side face on the thermal contact side being used to come into thermal contact with a heat source. An acute angle is set between the expanded side face of the air guide and the side face on the thermal contact side. The heat pipe penetrates the plate. On the opposite side of the heat dissipation fin when viewed from the side face on the thermal contact side, a fan used for generating an air flow is installed. The air guide and heat pipe are arranged in the flow path of air flow. Consequently, the air flow is guided to flow toward the heat pipe, and the amount of air passing through the heat pipe increases. |
