| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device which improves mounting efficiency by integrating a low-voltage circuit part and a high-voltage circuit part in one-chip and which can be mounted on a COF (Chip On Film) structure because heat can be efficiently radiated from the high-voltage circuit part.SOLUTION: A semiconductor integrated circuit device 60 comprises: a semiconductor integrated circuit 26 which is mounted on a COF substrate 14 and includes as one chip, a low-voltage circuit part 70 which operates at a low voltage, and a high-voltage circuit part 80 which operates at a high voltage higher than the low voltage; and a resin layer 25 for encapsulating the COF substrate 14 and the semiconductor integrated circuit 26, which are arranged on the COF substrate 14 in a flip-chip manner. The high-voltage circuit part 80 includes a power semiconductor device 34 and bumps 30 which combine electrical connection means and a heat radiation path and which are provided respectively on terminal electrodes of the power semiconductor device 34. |
