| 摘要 |
PROBLEM TO BE SOLVED: To achieve an electronic apparatus in which the heat dissipation of an IC element is improved when the IC element is mounted directly on a portion where a plurality of veer conductors are eccentrically located, for example.SOLUTION: A built-in coil substrate 1 comprises a substrate 11 and a coil 12 provided in the substrate 11. The coil 12 is formed from a plurality of coil conductors 12a to 12c. Each of the coil conductors 12a to 12c is formed from a plurality of conductor layers arranged one on another in a vertical direction and electrically connected to one another via a plurality of veer conductors 12d. The plurality of veer conductors 12d are arranged so as to be eccentrically located on a substrate 11 in a plan perspective view. |
