| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a support disk from being etched in an etching process performed after a wafer is bonded to the support disk.SOLUTION: The specification discloses a jig 2 for bonding a wafer 6 to a support disk 8. The jig 2 includes: a pedestal base 14; and a fixing jig 120. The support disk 8 has a chamfered part 8a formed between an upper surface and a side surface. The fixing jig 120 includes: first surfaces 121c, 122c which contact with the side surface of the support disk 8 to cover the side surface of the support disk 8 when the support disk 8 is fixed to the pedestal base 14; and second surfaces 121a, 122a which contact with the chamfered part 8a of the support disk 8 to cover the chamfered part 8a of the support disk 8.</p> |
