发明名称 GRINDING WHEEL
摘要 <p>PROBLEM TO BE SOLVED: To provide an inexpensive grinding wheel which is used for a grinding device for substrates of sapphire, SiC, or the like and accurately grinds the substrates at a high speed.SOLUTION: A grind wheel 10 is detachably attached to a wheel mount 8 of a grind device 1 including the wheel mount 8 rotationally driven and includes: a circular wheel base 11 attached to the wheel mount 8; and multiple grind stones 12 which are provided on one surface of the wheel base 11 and are arranged near an outer periphery of the wheel base 11 in an annular manner so as to be spaced by a predetermined distance away from each other. The wheel base 11 is formed by a resin member. Further, each grinding stone 12 is formed into a columnar shape and one side of a planar portion of the grind stone 12 is fixed to the wheel base 11.</p>
申请公布号 JP2014091193(A) 申请公布日期 2014.05.19
申请号 JP20120242658 申请日期 2012.11.02
申请人 TAKATORI CORP 发明人 TAKATORI TAKAMASA
分类号 B24D7/06;B24D7/10 主分类号 B24D7/06
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