METHOD FOR MANUFACTURING PRINTED-WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-wiring board having excellent smear removability capable of forming an insulating layer having high adhesion strength with a conductor layer although its roughness is low.SOLUTION: A method for manufacturing a printed-wiring board includes the successive steps of: laminating a resin sheet with a support including a support and a resin composition layer bonded to the support on an inner layer circuit board so that the resin composition layer is bonded to the inner layer circuit board (step (A)); forming an insulating layer by thermally curing the resin composition layer of the resin sheet with the support (step (B)); forming a via hole by perforating the insulating layer (step (C)); performing desmear processing (step (D)); peeling the support (step (E)); and forming a conductor layer on a surface of the insulating layer (step (F)).