| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer rotating device that is able to rotate a wafer in a treatment tank without occurrence of fine dust in order to eliminate uneven treatment of the wafer.SOLUTION: A wafer rotating device comprises: a treatment liquid tank 2 that contains a treatment liquid and allows a wafer to be impregnated in the treatment liquid; a wafer bearer 6 holding the lower intermediate portion of the wafer W in the treatment liquid tank 2 and configured to be able to swing in a direction along the surface of the wafer; and a pair of wafer guides 7 arranged so as to sandwich the wafer bearer 6 in the treatment liquid tank 2 and configured to be able to hold both the lower end portions of the wafer by vertically moving relative to the wafer bearer 6. While the wafer W is held by the wafer guide 7, the wafer bearer 6 is swung. Then, the wafer bearer 6 and wafer guide 7 are vertically moved relative to each other and the wafer W is returned to the wafer bearer 6. Thereby, using a different support portion of the wafer W on the wafer bearer 6, and the wafer is rotated. |
