| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of using existing facilities even when a diameter of a wafer becomes large.SOLUTION: A wafer processing method comprises the steps of: arranging a protection member 21 on a surface of a wafer 11; generating a fan-shaped 1/4 wafer piece by cutting a division schedule line of a first direction and a division schedule line of a second direction; thinning the 1/4 wafer piece by grinding a rear surface of the 1/4 wafer piece; positioning the 1/4 wafer piece at an opening of an annular frame, sticking an adhesive tape to the annular frame and the rear surface of the 1/4 wafer piece, peeling the protection member from the surface of the 1/4 wafer piece, and arranging the 1/4 wafer piece in the annular frame via the adhesive tape; and dividing the 1/4 wafer piece into individual devices by cutting all the division schedule lines of the first and second directions of the 1/4 wafer piece arranged in the annular frame. |
