| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive molded body which has superior thermal conductivity in a thickness direction of a molded body.SOLUTION: The thermally conductive molded body is a molded body having a thickness of less than 3 mm, which is obtained by molding a thermoplastic resin composition containing at least one kind of a plate-shaped or fibrous thermally conductive inorganic filler, has a ratio (molded body/gate thickness ratio) of the thickness of the molded body with respect to a gate diameter or a gate thickness in a metal mold of 2 or more, and has a coefficient of thermal conductivity measured in the thickness direction of the molded body of 1.0 W/(m K) or more. |
