| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a mold package, which can reduce formation of mold resin on a face exposed from the mold resin on a seat and which prevents leakage of mold resin during a sealing step.SOLUTION: A housing 40 is arranged so as to surround a circuit element 20 mounted on a circuit board 10. The circuit board 10 and housing 40 are sandwiched between a molding tool 200 and a placing table 300. The molding tool 200 is used as an upper mold, the housing 40 is used as lateral molds, and the circuit board 10 is used as a lower mold. Mold resin 30 is injected from a gate 202 into an area surrounded by the molding tool 200, housing 40, and circuit board 10, and thus this area is sealed with the mold resin. |
