| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition for sealing an optical semiconductor which gives a cured product excellent in impact resistance and adhesiveness, and to provide an optical semiconductor device in which an optical semiconductor element is sealed with a cured product obtained by curing the curable composition for sealing an optical semiconductor.SOLUTION: The curable composition for sealing an optical semiconductor contains (A) a linear polyfluoro compound, (B) a fluorine-containing organohydrogensiloxane having an SiH group and a fluorine-containing organic group, (C) a platinum group metal-based catalyst, and (D) a cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and an epoxy group. The type A durometer hardness specified in JIS K6253-3 of a cured product obtained by curing the curable composition for sealing an optical semiconductor is 30-80. |
