| 摘要 |
The objective of the present invention is to prevent blackening of a case, encapsulant, and organic degrading components of a die bonding material as well as suppress browning of the case, and lengthen a lifetime of the light emitting device by suppressing degradation of luminous intensity of a package. The light emitting device (1) comprises an LED chip (2), a case (5) made up of PCT, and an encapsulant (6) filling the case (5) to encapsulate the LED chip (2), wherein a stabilizing agent having a melting point 80°C higher than a bonding temperature Tj of the LED chip (2) exists in an interface between the inner walls of the case (5) and the encapsulant (6) or within 300μm from the interface. |
