| 摘要 |
PROBLEM TO BE SOLVED: To form a fine through electrode which is excellent in heat dissipation by using a glass base material.SOLUTION: A wiring board with a through electrode is constituted by using a glass base material mainly composed of SiO, comprises: a plurality of through holes 11 formed in the glass base material; a metal layer 13 with predetermined thickness formed on the surface of the glass base material 12 including the through holes; an insulation layer 14 formed on the surface of the metal layer and having predetermined thickness for preventing leak current from a through electrode 15; and the through electrode 15 consisting of a conductive material formed at parts of the through holes 11, is excellent in heat dissipation since the through holes 11 with comparatively large diameters can be formed in the glass base material 12, and the wiring board includes the metal layer 13 with excellent thermal conductivity and a fine through electrode can be attached to the wiring board by adjusting the thickness of the metal layer 13. |
