| 发明名称 |
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To properly downsize the device size in an electronic device formed by connecting two bonding surfaces with a bonding wire.SOLUTION: An electronic device is formed by connecting one bonding surface 11 and the other bonding surface 21 with each other by a bonding wire 30. The other bonding surface 21 is positioned above the one bonding surface 11 so that the one bonding surface 11 is arranged perpendicular to the other bonding surface 21.</p> |
| 申请公布号 |
JP2014093409(A) |
申请公布日期 |
2014.05.19 |
| 申请号 |
JP20120242830 |
申请日期 |
2012.11.02 |
| 申请人 |
DENSO CORP |
发明人 |
UENO YUMI ; YAMAGISHI TETSUTO ; HONDA MASAHIRO ; HARADA YOSHIHARU ; OTAKE SEIICHIRO |
| 分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
