| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a winding type electronic component in which occurrence of resin adhesion to an electrode is reduced, and solderability of the electrode is improved.SOLUTION: A method of manufacturing a winding type electronic component includes the steps of: preparing a protective sheet 10 which has an opening 10a and in which a pair of protrusions 10b are provided on portions facing each other on the edges of the opening 10a; bringing the pair of protrusions 10b into contact with an inner bottom surface C of a second flange 2c by making the opening 10a of the protective sheet 10 pass a winding type electronic component body 7 fixed to a holding tool 1 from the side of a first flange 2b; and providing external coating resin 8 on a conductive wire 4 in a region sandwiched by the first flange 2b and the second flange 2c by making the winding type electronic component body 7 with which the protrusions 10b are brought into contact intrude into resin 30 from the first flange 2b side until the protrusions 10b contact a liquid surface S of the resin 30. |
