发明名称 Temperature-controlled Purge gate valve for Chemical Vapor Deposition Chamber
摘要 <p>The present invention relates to methods and apparatus that are optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. Specifically, the methods relate to substantially preventing the formation of unwanted materials on an isolation valve fixture within a chemical vapor deposition (CVD) reactor. In particular, the invention provides apparatus and methods for limiting deposition/condensation of GaCl3 and reaction by-products on an isolation valve that is used in the system and method for forming a monocrystalline Group III-V semiconductor material by reacting an amount of a gaseous Group III precursor as one reactant with an amount of a gaseous Group V component as another reactant in a reaction chamber.</p>
申请公布号 KR101390425(B1) 申请公布日期 2014.05.19
申请号 KR20097012939 申请日期 2007.11.16
申请人 发明人
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
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