METHOD FOR SEPARATING DEVICE AND MANUFACTURING FLEXIBLE DEVICE USING LASER

摘要

Provided is a method for separating a device which includes the steps of: laminating a buffer layer on a sacrificial substrate; manufacturing a device on the buffer layer; and separating the device from the sacrificial substrate by irradiating laser on the rear surface of the sacrificial substrate where the device is manufactured, wherein the irradiated laser penetrates the sacrificial substrate and buffer layer and is irradiated in the device, and the sub-layer of the device is heated by the irradiated laser.